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HOREXS GROUP
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Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant

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Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant

Brand Name : Horexs

Model Number : NC-02

Certification : UL

Place of Origin : china

MOQ : 1000pieces

Price : US 0.1-0.12 each piece

Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000sqm/ month

Delivery Time : 7-10 working days

Packaging Details : carton customized

type : IC Packaging Substrate

dielectric layer : TR-4

Material : BT

flame retardant properties : V2

Mechanical rigid : rigid

Processing technic : Electrolytic foil

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Precision 0.15mm IC Packaging Substrate fabrication

Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.29mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:4 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrates,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

FAQ

  • Are You Factory/Manufacturer Or Trading Company?
  • We are factory/manufacturer of IC Package Substrate.
  • Do You Offer OEM/ODM Service?
  • Yes, we have rich experience in offering OEM/ODM service. Design service offered.
  • Can machines be used at outside?
  • With waterproof function, could be used at outsise.
  • 4. What is your MOQ?
  • Any quantity is acceptable.

Product Tags:

Precision IC Package Substrate

      

IC Package Substrate 0.15mm

      

V2 flame retardant IC Package Substrate

      
Quality Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant for sale

Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant Images

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